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RDK X5 Modular Case - closed / Fan / open / VESA

Print Profile(1)

All
A1
P1P
P2S
H2D
X1
H2C
H2D Pro
A2L
A1 mini
H2S
X2D
P1S
X1E
X1 Carbon

0.2mm layer, 6 walls, 25% infill
0.2mm layer, 6 walls, 25% infill
Designer
4.2 h
5 plates

Open in Bambu Studio
Boost
2
6
0
0
5
2
Released 

Description

The first open-source 3D-printable case for the D-Robotics RDK X5 (Sunrise X5, 10 TOPS BPU).
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ONE BASE, FOUR SWAPPABLE LIDS
• Default — closed lid with cooling slits
• Open — honeycomb vent (max airflow, heatsink exposed)
• VESA — 50×50 M4 mount
• Fan — 40 mm fan mount with a honeycomb intake grille (active cooling)
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DATA-ACCURATE PORTS
Every port cutout (USB-A ×2, RJ45, HDMI, audio, USB-C ×2, UART Micro-USB, 40-pin GPIO, microSD, fan) was extracted from the official D-Robotics STEP/DXF and verified against the real board, so the connectors line up.
The lids snap onto the base by press-fit (lip + full-perimeter snap ridge/groove) — no screws needed. Designed in OpenSCAD, fully parametric.
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FAN LID — RECOMMENDED HARDWARE (tested)
• Fan: 40 × 40 × 10 mm (4010), 5 V, 2-wire
• Screws: 4 × M3 × 15 mm — a perfect fit through the fan into the lid bosses
• Power: 40-pin header, pin 4 = 5V, pin 6 = GND
• Cooling (assembled, lid on): 66 °C passive → 41 °C with the fan (−25 °C)
• Even at full YOLO11 load (64 inferences/s for 60 s) it plateaus at ~51 °C — rock stable
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PRINT SETTINGS
• PLA / PETG, 0.2 mm layers, 3 walls, 15–20% infill, no supports
• Parts are oriented flat and ready to slice
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Source (OpenSCAD + STL/3MF): https://github.com/gurimaruking/rdk-x5-modular-case
License: CC BY 4.0 — share / remix / commercial use OK with credit.
Unofficial community design, not affiliated with D-Robotics; PCB geometry derived from D-Robotics' public mechanical drawings.
Made as a community contribution from Project Korosuke — my entry in the D-Robotics Robotics Dream Keeper Challenge.

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