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DFRobot SHT40 Fermion Case Cover

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PLA 0.16mm layer, 2 walls, 15% infill
PLA 0.16mm layer, 2 walls, 15% infill
Designer
10 min
1 plate

PETG 0.16mm layer, 2 walls, 15% infill
PETG 0.16mm layer, 2 walls, 15% infill
Designer
12 min
1 plate

Open in Bambu Studio
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Description

Low-profile 3D-printable case for the DFRobot Fermion: SHT40 Temperature & Humidity Sensor Breakout Board.

 

The case is designed with enough clearance underneath the PCB to allow wires to be soldered directly to the board. It includes wiring cutouts so the sensor can be connected without stressing the solder joints.

 

The enclosure uses a simple glued assembly. The cover should be attached with a flexible adhesive such as E6000 or a similar glue.

 

Ventilation holes are included on the top and sides of the case to maintain good airflow around the SHT40 sensor, helping it measure temperature and humidity accurately.

 

Features:

  • Low-profile enclosure
  • Space under the PCB for soldered wires
  • Cutouts for wiring
  • Top and side ventilation holes for airflow
  • Glue-together case and cover design
  • Suitable for DFRobot Fermion SHT40 breakout board

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License

This user content is licensed under a Standard Digital File License.

You shall not share, sub-license, sell, rent, host, transfer, or distribute in any way the digital or 3D printed versions of this object, nor any other derivative work of this object in its digital or physical format (including - but not limited to - remixes of this object, and hosting on other digital platforms). The objects may not be used without permission in any way whatsoever in which you charge money, or collect fees.