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Asrock B660M-HDVP/D5 IO Panel
IP Report
Print Profile(1)
0.28mm layer, 2 walls, 15% infill
Designer
23 min
1 plate
Open in Bambu Studio
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Description
This file is the rear I/O panel model file for the Asrock B660M-HDVP/D5 model.
Although it does not fit perfectly into the ports, it can simply cover the rear panel in cases where there is no rear I/O panel.
We recommend using PETG or ABS.
When outputting, if you set the output scale to "100.6%", it attaches perfectly to the case IO panel area.
License
This user content is licensed under a
Creative Commons Attribution
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