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Raspberry Pi 4 Case

Remixed by

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A2L

0.2mm layer, 2 walls, 15% infill
0.2mm layer, 2 walls, 15% infill
Designer
3.8 h
3 plates
4.8(4)

Open in Bambu Studio
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Description

Modified Didier's (which is modified from Malolo's) Raspberry Pi 4 Model B case. 

 

Most of the top is raised to accommodate a heatsink with fan. Also includes cutouts for the camera cable and GPIO wires. Snaps together well, the exact same as the originals.

 

The project includes one version of the top with a scaffold interface of Support for PLA and one without.

 

 

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