Phone / Tablet Disassemble & Repair Tool - Free 3D Print Model

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IP Report

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A1 mini

P1S

P1P

X1 Carbon

X1E

H2D

H2D Pro

H2S

P2S

H2C

X2D

A2L

0.08mm layer, 2 walls, 15% infill

15 min

1 plate

4.7(27)

Open in Bambu Studio

Boost

110

439

337

Released

Description

Easily 3D Printed tool that is used to remove adhesive between two parts that have tight tolerances between them and are fragile. Most commonly used when removing touch screen from an phone or tablet.

IF YOU HAVE A RESIN 3D PRINTER I WOULD RECCOMEND THAT

Print Settings:

Material: PET-G or PLA

Layer Height: 0.15

Speed: Go slower for the first layer

Comment & Rating (27)

@LepkavaKoza

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0.08mm layer, 2 walls, 15% infill

🙏

@PoopChuter

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0.08mm layer, 2 walls, 15% infill

@makerofchaos

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0.08mm layer, 2 walls, 15% infill

works. thank you

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@bulls

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0.08mm layer, 2 walls, 15% infill

Perfect for removing screens

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@achim.schilling

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0.08mm layer, 2 walls, 15% infill

Works perfectly fine.

@Zalusky

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0.08mm layer, 2 walls, 15% infill

good

@JanGruber42

Print Profile

0.08mm layer, 2 walls, 15% infill

These printed just fine. They were really useful and in my opinion even better than the ones you get with dissasembly kits since the edge is thinner. I printed them in Bambu Tough PLA. If you are careful during the dissasembly of your phone you might be able to reuse them. Almost all of mine are now bent and I'll have to print new ones if I have to disassemble a phone again.