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HW770 modul case

IP Report

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All
A1 mini
P1S
H2C
H2S
X1
H2D
A1
H2D Pro
P1P
X1 Carbon
X1E
P2S
X2D
A2L

0.16mm layer, 3 walls, 15% infill
0.16mm layer, 3 walls, 15% infill
Designer
22 min
1 plate
5.0(3)

Open in Bambu Studio
Boost
18
33
5
0
69
11
Released 

Description

Case for HW770 bluetooth module. Step editable in case of using of more IO

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