MCP2515 CAN-BUS MODULE CASE

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MCP2515 CAN-BUS MODULE CASE

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Print Profile(1)

All
X1 Carbon
P1S
P1P
X1
X1E
A1

0.2mm layer, 2 walls, 25% infill
0.2mm layer, 2 walls, 25% infill
Designer
1.3 h
1 plate

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Released

Description

MCP2515 serves as a practical communication protocol for many industrial and automotive applications. Not only that, but it also offers other features, including TJA1050 high-speed IC and MCP 2515 IC integration. You can even allow this device to communicate with microcontrollers via the SPI interface.

However, you will need two CAN bus modules to achieve 1MB/s communication transmission.

 

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