Quick Unpacking Tool for SMT Packages 贴片器件快速拆封工具

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Quick Unpacking Tool for SMT Packages 贴片器件快速拆封工具

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All
A1 mini
P1S
P1P
X1
X1 Carbon
X1E
A1

0.2mm nozzle, 0.1mm layer, 6 walls, 15% infill
0.2mm nozzle, 0.1mm layer, 6 walls, 15% infill
Designer
55 min
1 plate

Open in Bambu Studio
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Description

Description:

This quick transfer tool for electronic components is designed for handling the unpacking of small surface-mount technology (SMT) components. With this tool, users can easily unpack and precisely pour components from the tape into a component box, perfectly fitting a small 17mm x 17mm box. The design utilizes 3D printing technology, making it easy to produce and use.

Note

Specifically designed for component boxes of 17mm x 17mm and above, ensuring accuracy and convenience during the component transfer process.

Insert the tool into the tape and pull the sealing tape in the direction of insertion, allowing components to smoothly transfer to the component box.


介绍:
这款电子元件快速转移工具是为处理微小贴片器件拆封而设计的。使用该工具,用户可以轻松地从贴片器件条带中拆开并准确倒入元件盒中,尺寸精确配合17mm x 17mm的小型元件盒。该设计利用3D打印技术,便于制作和使用


注意:

专为1.7mm x 1.7mm尺寸及以上的元件盒设计,确保元件转移过程中的准确性和便捷性。
直接将工具插入元件条带并在插入方向拉动封口胶带,元件即可顺利转移到元件盒中。

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