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Soldering Stand
IP Report
Print Profile(1)
0.2mm layer, 2 walls, 15% infill
Designer
2.1 h
1 plate
Open in Bambu Studio
Boost
6
13
0
0
11
7
Released
Description
Content has been automatically translated.
Sponge dimensions: Length 48mm, Width 35mm, Thickness 4mm (can be slightly larger, but not smaller; too small will not hold)
Rosin dimensions: White rosin: Length 48mm, Width 22mm
Solder wire hole diameter greater than 18mm
Total weight: 52g
Note supports
License
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You shall not share, sub-license, sell, rent, host, transfer, or distribute in any way the digital or 3D printed versions of this object, nor any other derivative work of this object in its digital or physical format (including - but not limited to - remixes of this object, and hosting on other digital platforms). The objects may not be used without permission in any way whatsoever in which you charge money, or collect fees.
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