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青铜扳子com

@user_693789255

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231

Published Models (20)Published Print Profiles (26)

ESP32S3-SI4732 Radio - Rotary Encoder Case

0.1mm layer, 3 walls, 15% infill

Designer

P1S, H2C, X2D, X1E, X1, X1 Carbon, H2D, H2S, A1 mini, P1P, A1, P2S, H2D Pro, A2L

5.7 h

3 plates

57 g

ESP32S3-SI4732 Radio

0.16mm layer, 3 walls, 15% infill

Designer

5.0

P1S, H2D, X1, H2C, X1 Carbon, A1, A1 mini, H2D Pro, H2S, X1E, P2S, P1P, X2D, A2L

3.4 h

1 plate

50 g

SI4732 radio case, 18650 magnetic base

0.16mm layer, 3 walls, 20% infill

Designer

P1S, H2S, H2C, H2D Pro, P1P, A1 mini, X1, X1 Carbon, H2D, P2S, A1, X1E, X2D, A2L

14.1 h

5 plates

298 g

Multi-degree-of-freedom auto-centering device

0.16mm layer, 3 walls, 20% infill

Designer

P1S, P1P, A1 mini, X1E, H2D Pro, X1 Carbon, X1, H2D, H2S, A1, H2C, P2S, X2D, A2L

1.3 h

2 plates

15 g

GIF

BBS-Buffer-A xMCU Series Buffer

0.16mm layer, 3 walls, 20% infill

Designer

A1 mini, H2S, X1 Carbon, X1, H2C, X1E, P1S, P1P, H2D Pro, A1, H2D, P2S, X2D, A2L

3.8 h

3 plates

36 g

Raspberry Pi Thermal Imager

0.2mm layer, 2 walls, 15% infill

Designer

A1 mini, P1S, X1 Carbon, A1, X1, H2D Pro, H2S, X1E, H2D, P1P, P2S, H2C, X2D, A2L

3.2 h

5 plates

61 g

Raspberry Pi Thermal Imager

0.2mm layer, 2 walls, 15% infill

Designer

A1 mini, A1, P1P, X1E, H2D, X1, X1 Carbon, P1S, H2D Pro, H2S, P2S, H2C, X2D, A2L

2 h

3 plates

37 g

Side-hung - Type A1 beam bracket

0.2mm layer, 2 walls, 15% infill

Designer

A1 mini, H2D, P1S, X1 Carbon, X1, P1P, A1, X1E, H2D Pro, H2S, P2S, H2C, X2D, A2L

4.4 h

3 plates

110 g

BMCU - Hall - Fully Enclosed Gearbox

0.2mm layer, 2 walls, 15% infill

Designer

A1 mini, P1S, H2D, X1E, P1P, X1 Carbon, X1, A1, H2D Pro, H2S, P2S, H2C, X2D, A2L

3.8 h

2 plates

62 g

P1S rear cover exhaust connector, any angle.

0.2mm layer, 3 walls, 15% infill

Designer

P1S, X1 Carbon, X1, A1, H2D, P1P, X1E, H2D Pro, H2S, P2S, H2C, X2D, A2L

4.5 h

1 plate

147 g

Raspberry Pi Thermal Imager

0.2mm layer, 2 walls, 15% infill

Designer

A1 mini, X1E, A1, P1S, X1 Carbon, H2D, P1P, X1, H2D Pro, H2S, P2S, H2C, X2D, A2L

1.5 h

1 plate

31 g

Four-Spool Rack Assembly Module

Multi-part Module - Edge Damper

Designer

A1 mini, A1, P1P, X1 Carbon, X1E, P1S, H2D, X1, H2D Pro, H2S, P2S, H2C, X2D, A2L

2.5 h

1 plate

67 g

GIF

4L Filament Bucket - B1 Electric Rewind

Filament Runout Sensor Update (Full Spool)

Designer

A1 mini, X1E, H2D, X1 Carbon, A1, P1P, X1, P1S, H2D Pro, H2S, P2S, H2C, X2D, A2L

30 min

1 plate

8 g

4L Filament Bucket - B1 Electric Rewind

The bracket height has been reduced by 5mm for quad configurations, requiring only an update to these two brackets, also compatible with 4L rice buckets

Designer

A1 mini, A1, P1S, X1E, H2D, X1, P1P, X1 Carbon, H2D Pro, H2S, P2S, H2C, X2D, A2L

3.4 h

1 plate

73 g

4L Rice Bucket Lid

0.2mm layer, 2 walls, 15% infill

Designer

A1 mini, H2D, X1 Carbon, A1, X1E, X1, P1P, P1S, H2D Pro, H2S, P2S, H2C, X2D, A2L

53 min

1 plate

21 g

GIF

4L Filament Bucket - B1 Electric Rewind

0.2mm layer, 2 walls, 15% infill

Designer

A1 mini, H2D, P1P, P1S, X1E, X1 Carbon, A1, X1, H2D Pro, H2S, P2S, H2C, X2D, A2L

6.9 h

4 plates

133 g

Four-Spool Rack Assembly Module

0.2mm layer, 2 walls, 15% infill

Designer

A1 mini, X1E, H2D, X1 Carbon, A1, P1P, X1, P1S, H2D Pro, H2S, P2S, H2C, X2D, A2L

4.9 h

1 plate

116 g

BMCU-370-Three Steel Balls-Three Gears-Full Engagement-Universal Base

0.2mm layer, 2 walls, 15% infill

Designer

5.0

A1 mini, P1S, P1P, X1, X1 Carbon, X1E, A1, H2D, H2D Pro, H2S, P2S, H2C, X2D, A2L

6.3 h

7 plates

107 g

Bearing (Bearing Housing) Assembly Tool

0.2mm layer, 2 walls, 20% infill

Designer

A1 mini, P1S, P1P, X1, X1 Carbon, X1E, A1, H2D, H2D Pro, H2S, P2S, H2C, X2D, A2L

1.1 h

1 plate

8 g

Server power supply half-shell

0.2mm layer, 2 walls, 15% infill

Designer

A1 mini, P1S, P1P, X1, X1 Carbon, X1E, A1, H2D, H2D Pro, H2S, P2S, H2C, X2D, A2L

3.5 h

1 plate

63 g