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盈满则缺丶
@user_479225909
0.2mm 层高, 3 层墙, 15% 填充

AMS2 filament dust cleaner

0.2mm layer, 3 walls, 15% infill

Designer
9
3
P2S, A1, P1P, H2C, A1 mini, X1E, H2D, H2D Pro, H2S, X1 Carbon, X1, P1S, X2D, A2L
50 min
1 plate
7 g
0.2mm 层高, 3 层墙, 15% 填充

ams2 filament feed dust filter, saver

0.2mm layer, 3 walls, 15% infill

Designer
4
2
P2S, A1, P1P, H2C, A1 mini, X1E, H2D, H2D Pro, H2S, X1 Carbon, X1, P1S, X2D, A2L
28 min
1 plate
4 g
0.2mm 层高, 2 层墙, 15% 填充

BMCU Twin Micro High Torque Exclusive Edition

0.2mm layer, 2 walls, 15% infill

Designer
5
1
A1, P2S, H2D Pro, H2S, H2D, H2C, X2D, A2L
13.7 h
3 plates
261 g
0.2mm 层高, 3 层墙, 15% 填充

370 Dual Micro High Torque BMCU

0.2mm layer, 3 walls, 15% infill

Designer
2
2
A1, P1S, X1 Carbon, H2S, H2D Pro, X1, X1E, H2D, P1P, P2S, H2C, X2D, A2L
15.8 h
6 plates
335 g
A1, H2D Pro, P1P, X1, P1S, H2S, X1 Carbon, X1E, H2D, P2S, H2C, X2D, A2L
15.8 h
6 plates
335 g
A1, P1S, X1 Carbon, H2S, H2D Pro, X1, X1E, H2D, P1P, P2S, H2C, X2D, A2L
15.7 h
6 plates
332 g
0.2mm 喷嘴, 0.1mm 层高, 4 层墙, 15% 填充

370 Dual Micro High Torque BMCU

0.2mm nozzle, 0.1mm layer, 4 walls, 15% infill

Designer
0
0
A1, P1P, X1E, A1 mini, P1S, H2D Pro, H2D, X1 Carbon, X1, H2S, P2S, H2C, X2D, A2L
20.6 h
1 plate
72 g
0.2mm 层高, 3 层墙, 15% 填充

370 Dual Micro High Torque BMCU

0.2mm layer, 3 walls, 15% infill

Designer
1
0
A1, P1S, X1 Carbon, H2S, H2D Pro, X1, X1E, H2D, A1 mini, P1P, P2S, H2C, X2D, A2L
7.7 h
1 plate
145 g
0.2mm 层高, 3 层墙, 15% 填充

370 Dual Micro High Torque BMCU

0.2mm layer, 3 walls, 15% infill

Designer
1
0
A1, H2D Pro, P1P, X1, P1S, H2S, X1 Carbon, X1E, A1 mini, H2D, P2S, H2C, X2D, A2L
7.7 h
1 plate
145 g
0.2mm 层高, 3 层墙, 15% 填充

370 Dual Micro High Torque BMCU

0.2mm layer, 3 walls, 15% infill

Designer
4
0
A1, X1, A1 mini, X1E, P1P, H2D Pro, H2S, P1S, H2D, X1 Carbon, P2S, H2C, X2D, A2L
7.7 h
1 plate
145 g
0.2mm 层高, 3 层墙, 15% 填充

370 Dual Micro High Torque BMCU

0.2mm layer, 3 walls, 15% infill

Designer
35
7
A1, X1, A1 mini, X1E, P1P, H2D Pro, H2S, P1S, H2D, X1 Carbon, P2S, H2C, X2D, A2L
6.6 h
1 plate
121 g
0.2mm 层高, 3 层墙, 15% 填充

370 Dual Micro High Torque BMCU

0.2mm layer, 3 walls, 15% infill

Designer
5.0
27
5
A1, X1, A1 mini, X1E, P1P, H2D Pro, H2S, P1S, H2D, X1 Carbon, P2S, H2C, X2D, A2L
6.6 h
1 plate
121 g
0.2mm 层高, 3 层墙, 15% 填充

Fryer 210 245 470 soldering iron backplate

0.2mm layer, 3 walls, 15% infill

Designer
5
0
A1, H2D, P1S, P1P, X1 Carbon, X1E, X1, A1 mini, H2D Pro, H2S, P2S, H2C, X2D, A2L
1.1 h
1 plate
17 g
0.2mm 层高, 3 层墙, 15% 填充

Fry Fish Boss 210 245 470 soldering iron shell

0.2mm layer, 3 walls, 15% infill

Designer
10
0
A1, H2D, P1S, P1P, X1 Carbon, X1E, X1, A1 mini, H2D Pro, H2S, P2S, H2C, X2D, A2L
4.4 h
1 plate
109 g
0.2mm 层高, 3 层墙, 15% 填充

Fry Fish Master 210 245 470 Soldering Iron Panel

0.2mm layer, 3 walls, 15% infill

Designer
6
0
A1, H2D, P1S, P1P, X1 Carbon, X1E, X1, A1 mini, H2D Pro, H2S, P2S, H2C, X2D, A2L
28 min
1 plate
8 g
0.2mm 层高, 3 层墙, 15% 填充

Fryer 210 245 470 soldering iron station

0.2mm layer, 3 walls, 15% infill

Designer
5
0
A1, H2D, P1S, P1P, X1 Carbon, X1E, X1, A1 mini, H2D Pro, H2S, P2S, H2C, X2D, A2L
21 min
1 plate
4 g
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