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Damon
@user_3281628937
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Published Models (2)Published Print Profiles (2)
0.2mm 层高, 2 层墙, 15% 填充

Universal semiconductor cooling chip phone cooler, no hardware or magnetic absorption needed, adjustable tightness

0.2mm layer, 2 walls, 15% infill

Designer
6
2
A1 mini, A1, X1 Carbon, H2D, P1S, X1E, P1P, X1, H2D Pro, H2S, P2S, H2C, X2D, A2L
2 h
1 plate
31 g
0.2mm 层高, 2 层墙, 15% 填充

Universal Bambu Lab A1/A1 mini waste bin, featuring an ultralight baffle, extra-large capacity, and a modular design to reduce cantilever stress

0.2mm layer, 2 walls, 15% infill

Designer
4.5
997
554
A1 mini, P1S, P1P, X1, X1 Carbon, X1E, A1, H2D, H2D Pro, H2S, P2S, H2C, X2D, A2L
5.1 h
1 plate
87 g
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