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user_1486413146
@user_1486413146
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Published Models (3)Published Print Profiles (3)
0.2mm 层高, 2 层墙, 15% 填充，开热床粘接

thermal label roll core,

0.2mm layer, 2 walls, 15% infill, bed adhesion enabled

Designer
5.0
17
13
P1S, X1E, A1 mini, H2D, H2D Pro, X1 Carbon, P1P, A1, X1, H2S, P2S, H2C, X2D, A2L
21 min
1 plate
4 g
0.2mm 层高, 2 层墙, 15% 填充

100W/140W Single-Channel Buck Converter Power Supply Module Enclosure, Multi-Hole Heat Dissipation

0.2mm layer, 2 walls, 15% infill

Designer
43
19
P1S, P1P, H2D, X1, X1E, X1 Carbon, A1, A1 mini, H2D Pro, H2S, P2S, H2C, X2D, A2L
1.2 h
1 plate
14 g
0.2mm 层高, 2 层墙, 15% 填充

Enclosure for dual-channel 100W or 140W step-down module motherboard (SW3518 or SW3538), with 2507 fan cutouts

0.2mm layer, 2 walls, 15% infill

Designer
5.0
81
17
P1S, P1P, X1, X1 Carbon, H2D, X1E, A1, A1 mini, H2D Pro, H2S, P2S, H2C, X2D, A2L
2 h
1 plate
53 g
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