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user_1252889775
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G
I
F
USB to TTL module casing
0.12mm layer, 5 walls, 30% infill
Designer
5.0
2
1
X1 Carbon, A1, P1S, P1P, H2D Pro, H2S, P2S, X1, H2C, A1 mini, X1E, H2D, X2D, A2L
53 min
1
plate
15 g
G
I
F
Heavy-Duty Heat Set Insert Press Tool
0.2mm layer, 5 walls, 15% infill
Designer
2
0
H2S, H2D Pro, H2D, H2C
9.7 h
1
plate
281 g
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