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Lenovo Y700 2023 Simplified Casing
IP Report
Print Profile(1)
0.16mm layer, 2 walls, 12% infill
Designer
1.5 h
1 plate
Open in Bambu Studio
Boost
7
9
0
3
41
12
Released
Description
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A simplified case modeled after the Lenovo Y700 Gen 2, prioritizing heat dissipation. The enclosing structure offers enhanced robustness; a strong, adhesive material is recommended for printing. Future plans include designing handles and grip assist structures. PLA filament is suggested. V1.1 features optimized button and speaker openings.
License
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Creative Commons Attribution-Noncommercial
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