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8838 JBC245 Soldering Station Metal Casing Back Cover Plate
IP Report
Print Profile(4)
1.5 slot, 0.2mm layer, 4 walls, 15% infill
Designer
1.1 h
3 plates
2.0 snap-fit, 0.2mm layer, 4 walls, 15% infill
Designer
1.1 h
3 plates
1.5 Large Gap Version, 0.2mm layer, 4 walls, 15% infill
Designer
1.1 h
3 plates
2.0 Large Gap Version, 0.2mm layer height, 4 walls, 15% infill
Designer
1.1 h
3 plates
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Description
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The power socket module slots are available in 1.5 and 2.0 models
After installing the 245 motherboard, there are large gaps in the metal casing. You can find cover plates for large gaps in the print profile
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License
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