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Ventilated Electronics Enclosure
IP Report
Print Profile(1)
0.2mm layer, 6 walls, 25% infill
Designer
4 h
1 plate
Open in Bambu Studio
Boost
4
12
0
0
13
9
Released
Description
A clean and functional 3D printable enclosure designed for electronics projects, prototyping, and small embedded systems.
This model features a minimalist box design with integrated ventilation patterns for airflow and thermal management, making it suitable for components that require passive cooling.
License
This user content is licensed under a
Creative Commons Attribution-Noncommercial-Share Alike
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