TP Link EAP773 Elevated Cooling Platform

TP-Link Omada WiFi 7 Wireless Access Point EAP773

Elevated Cooling Platform for TP-Link Omada Access Points

This custom-designed tabletop platform is engineered to solve the heat dispersal issues common with high-performance TP-Link Omada endpoints (such as the EAP773). Ideally these should be wall mounted, but sometimtes you can't for a variety of reasons. By lifting the unit off your desk or furniture, it provides passive cooling while protecting your surfaces.

Key Design Features:

• Passive Thermal Management: Elevates the Omada access point exactly 45mm off the tabletop. This creates a critical air gap that allows ambient airflow to dissipate heat from the bottom of the device before it can build up.
• Surface Protection: By utilizing the natural thermal insulating properties of 3D printed filament alongside the 45mm standoff, this stand completely protects delicate wood surfaces and finishes from the constant heat output of enterprise-grade networking gear.
• Integrated Cable Routing Channel: Refined in V3, the base features a dedicated, snag-free cable routing channel. This allows thick Ethernet (PoE) cables to exit cleanly flush with the desk, preventing the cords from catching on the rim or tipping the unit. It's not perfect but it's better than nothing.

I'd reccomend putting some thin rubber on the top where the stand interfaces between the EAP, and maybe putting the base on a coaster or something soft if you have it on a piece of furniture (or put little gummy / rubber feet on the base bottom.)

Enjoy!