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Fiio K3 travel case
IP Report
Print Profile(1)
0.16mm layer, 2 walls, 15% infill
Designer
3.2 h
2 plates
Open in Bambu Studio
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Description
Fiio K3 DAC. Two parts snap-in hinge. Third one is for the DAC to be locked in position in the box- prefferably TPU or soft PETG. The case can be PETG or PLA, or other stiff filaments. Minimal support needed as sliced in studio.
Fiio K3 DAC headphone amplifier https://www.fiio.com/k3s)
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