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Raspberry Pi 5 test print for billet aluminum case

Print Profile(1)

All
P1S
X1E
P2S
A1 mini
X1
P1P
X1 Carbon
H2D
H2D Pro
A1
H2C
H2S
X2D
A2L

0.2mm layer, 6 walls, 25% infill
0.2mm layer, 6 walls, 25% infill
Designer
1.2 h
1 plate
5.0(1)

Open in Bambu Studio
Boost
1
2
2
0
4
2
Released 

Bill of Materials

List other parts
  • M2.5x8mm Stainless Steel Countersunk Flat Head Phillips Machine Screws x 4: Screws paid link (https://amzn.to/3OkCwHL)

Description

Screws paid link (https://amzn.to/3OkCwHL)

 

This is a test print / fit-check prototype for an upcoming premium billet aluminum case for the Raspberry Pi 5 (designed for the 8GB version, with easy adaptation for 4GB via thermal pad shim).Use this 3D printable version to verify fit, port alignment, tolerances, thermal pad / heatsink placement, screw holes, and overall ergonomics before committing to CNC machining the final aluminum enclosure. Many high-end Pi 5 aluminum cases start life exactly like this—3D printed proofs that save time and material.Why this test print exists
I’m developing a sleek, durable, passive-cooled (or fan-optional) billet 6061 aluminum case with precise cutouts, excellent heat dissipation via integrated thermal contact points, and a premium machined finish. This prototype lets the community test the design early, provide feedback on real-world tolerances (shrinkage, layer lines affecting fit, etc.), and help refine the final machined version.Key Features of this Test Print

  • Exact 1:1 scale replica of the planned aluminum case internals and externals
  • Precise cutouts for all Pi 5 ports: dual HDMI, USB 3×2, USB-C power, Gigabit Ethernet, PCIe FFC slot, microSD, GPIO access
  • Openings for official/active cooler or custom heatsink pillars
  • Mounting points for M2.5 screws (paid link https://amzn.to/3OkCwHL)
  • Clearance checks for RAM/SoC height differences (8GB vs 4GB)
  • Optional top vent slots for airflow testing
  • Easy snap-fit or screw-together assembly (print top/bottom separately)

Printing Recommendations

  • Printer: Bambu Lab X1C / P1S / A1 series (or any FDM printer with good dimensional accuracy)
  • Material: PLA or PETG (for better durability during repeated test fits); ABS/ASA if you want closer thermal expansion match to aluminum
  • Layer height: 0.20 mm (0.16 mm for tighter tolerances on critical fit areas)
  • Infill: 15–25% grid
  • Walls: 3–4 perimeters (1.2–1.6 mm wall thickness)
  • Supports: None 
  • Tolerances tip: Print a small calibration cube first if your printer is not dialed in; most users find 0.1–0.15 mm horizontal expansion compensation works well for snug Pi board fit.
  • Print time: ~1-1.5 hours depending on settings and printer

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License

This user content is licensed under a Standard Digital File License.

You shall not share, sub-license, sell, rent, host, transfer, or distribute in any way the digital or 3D printed versions of this object, nor any other derivative work of this object in its digital or physical format (including - but not limited to - remixes of this object, and hosting on other digital platforms). The objects may not be used without permission in any way whatsoever in which you charge money, or collect fees.