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AI thermal printer case

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All
P1P
H2C
H2D Pro
H2D
P2S
A1 mini
X1
P1S
A1
H2S
X1E
X1 Carbon
X2D
A2L

0.2mm layer, 2 walls, 15% infill
0.2mm layer, 2 walls, 15% infill
Designer
2.9 h
1 plate

Open in Bambu Studio
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Description

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This is an enclosure case designed to house the Xiaomiao Technology's Future Board LiteAI board and their thermal printer system. This case brings together the scattered modules and wires.

 

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