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ESP32-C6-Relay-X1 Wall-Mount Enclosure

Print Profile(1)

All
X1 Carbon
H2C
H2D Pro
H2D
P2S
P1P
X1
P1S
A1
H2S
X1E
X2D
A2L

0.2mm layer, 2 walls, 15% infill
0.2mm layer, 2 walls, 15% infill
Designer
1.3 h
1 plate
5.0(1)

Open in Bambu Studio
Boost
9
23
5
1
14
10
Released 

Description

This 3D-printed enclosure is a purpose-built variant for the ESP32-C6-Relay-X1, designed specifically for hot water recirculating pump control. The ESP32-C6-Relay-X1 is well-suited to this application, thanks to its wide input-voltage tolerance and an onboard relay capable of switching mains-rated recirculation pumps where required.

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The housing includes dedicated wire outlets sized for 1.6 mm and 2.5 mm conductors, providing clean routing for higher-current wiring. An internal jumper-wire retention clip acts as a “poor-man’s” 4-pin 2.54 mm JST connector, securely holding standard jumper wires in place without requiring a soldered JST socket.

 

The enclosure is tall enough to fully accommodate internal jumper wiring, keeping all connections protected once assembled. Power input and relay terminals remain accessible with the enclosure top removed for commissioning or servicing.
 

A separate wall-mount clip allows tool-less installation on flat surfaces when required. The snap-fit, friction-lock design includes screwdriver relief indents to make opening the enclosure or removing the PCB straightforward if the fit is snug.

 

Planned Home Assistant integration and stand-alone C++ firmware for hot water recirculation control are scheduled for release in April 2026, following extended field testing.

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