Bambulab P1S E3D High Flow ObXidian ABS_ASAProfile

Profile Description – eSUN ABS+ Black on Bambu Lab P1S (E3D High Flow ObXidian)

This profile is optimized for eSUN ABS+ (ABS Pro) in black and runs on a
Bambu Lab P1S with E3D Revo High Flow ObXidian 0.4 mm

eSUN ABS+ is an improved ABS with reduced shrinkage and better layer adhesion, especially for technical, robust parts with higher temperature resistance

The goal of this profile is to produce stable, temperature-resistant functional components, such as:

• Housings and covers
• Brackets, clips, adapters
• RC/model building parts
• mechanically stressed everyday components

Also works with a stock P1S/X1 with a 0.4mm nozzle; the high-flow hotend only gives you a little more headroom for high volumetric flow rates

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Tested Setup

• Printer: Bambu Lab P1S
• Hotend/Nozzle: E3D Revo High Flow ObXidian, 0.4 mm
• Part Fan: Biqu Panda Turbo Fan + Panda Jet Duct
• Build Plate: Textured PEI Plate
• Chamber: Enclosed, slightly heated (approx. 45–55 °C)
• Filament: eSUN ABS+ (ABS Pro) Black, 1.75 mm

The manufacturer's recommended printing temperature is approximately 230–270 °C, and the bed at 95–110 °C – the profile intentionally stays within this range

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Recommended Application

Top Use Cases:

• Technical/Engineering parts
• Components in slightly warm environments (electronics, devices, interiors)
• Impact & Stress: Brackets, connectors, functional clips

Less suitable for:

• Open-frame printers without enclosures
• Highly decorative miniatures (ASA/PLA is often optically simpler for these)