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Thermaltake Core P3 open case radiator air ducts
IP Report
Print Profile(1)

0.2mm layer, 2 walls, 15% infill
Designer
1.9 h
1 plate
Open in Bambu Studio
Boost
6
14
1
0
10
4
Released
Description
Rather than having hot air from your radiator collect inside your case heating up motherboard, push it through the vent directly out.
Print in PETG to prevent warping and attach with thin double sided tape.
License
This user content is licensed under a
Creative Commons Attribution-Noncommercial





Comment & Rating (1)