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bmcu-c (370 Hall version) mainboard + sub-board steel mesh

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A1
P1S
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P1P
H2D
X1E
H2D Pro
H2S
P2S
H2C
X2D
A2L

0.2mm nozzle, 0.06mm layer height, 4 walls, 15% infill
0.2mm nozzle, 0.06mm layer height, 4 walls, 15% infill
Designer
1.2 h
1 plate
5.0(1)

Open in Bambu Studio
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13
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2
0
9
0
Released 

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The filament used in the image is Bambu PLA Matte White, with a 0.2mm nozzle.

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