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Snap fit slim case for Node MCU ESP8266
IP Report
Print Profile(1)
0.24mm layer, 2 walls, 15% infill
Designer
22 min
1 plate
Open in Bambu Studio
Boost
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Released
Description
I was looking for a slim ESP8266 case that allowed me access to the pins from the side with room to bend/snip them. This design allowed me to fit the board in behind a sign I made to be used with WLED.
Modelled around this CAD model by Ronald Knerr made in Fusion 360.
Fits a board aprox 49x26mm. Due to the thickness of the standoffs this case would not suite excessive opening and closing.
Printed on PS1 with black Sunlu PLA+ (Bambu basic PLA profile) with the 0.24mm draft profile with normal auto supports.
Happy printing!
License
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Creative Commons Attribution-Noncommercial-Share Alike
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