bmcu - c Hall sensor version auxiliary soldering print stencil includes mainboard and sub-board
Print Profile(4)
Description
bmcu-c (Hall sensor version) printed stencil
Printing precision is limited, suitable for individual users (mass production requires dedicated stencils), convenient for solder paste application
A 0.2 nozzle is recommended for printing(a 0.4 nozzle can also be used), otherwise, details such as microcontroller pins and some pads cannot be printed. After printing, place the circuit board in the recess, align the pads, and apply solder paste; manual solder paste application is unnecessary
Main and sub-boards use the PCB from the BMCU-V0.6-Third Verification document
Optimized 0.2 nozzle slicing settings for enhanced printing success rate
2025-4-24
Further optimization of 0.2 nozzle print parameters; theoretically, the resulting print quality will be superior
Boost Me (for free)
License
You shall not share, sub-license, sell, rent, host, transfer, or distribute in any way the digital or 3D printed versions of this object, nor any other derivative work of this object in its digital or physical format (including - but not limited to - remixes of this object, and hosting on other digital platforms). The objects may not be used without permission in any way whatsoever in which you charge money, or collect fees.
Comment & Rating (0)