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Gridfinity DIP Chip Bin
IP Report
Print Profile(1)
0.2mm layer, 1 walls, 5% infill
Designer
3.5 h
1 plate
Open in Bambu Studio
Boost
44
122
8
6
131
60
Released
Description
For storing DIP (Dual Inline Package) based chips.
Gets rid of the many storage bins.
A little stiff to insert using PLA (haven't tried other materials) recommend using a leg straightener before hand if you have it.
Bin is broken in parts so you can colour it the way you'd like.
Holes are 2.54mm apart as is standard for a breadboard and starts from 2mm and slopes down to 1mm. This seemed to be the optimal fit when printing with 0.4mm nozzle.
License
This user content is licensed under a
Creative Commons Public Domain
Comment & Rating (8)