电路板外壳3d打印

Copyright Claim

电路板外壳3d打印

Boost
1
0
2

Print Profile(1)

All
X1 Carbon
P1S
P1P
X1
X1E
A1

0.2mm layer, 4 walls, 15% infill
0.2mm layer, 4 walls, 15% infill
Designer
1.5 h
1 plate

Open in Bambu Studio
Boost
1
0
2
2
0
0
Released

Description

此模型原本为注塑件,打印后部分强度可能不如原件

Comment & Rating (2)

Please fill in your opinion
(0/5000)

Boosted
0
Reply
Boosted
感谢分享
0
Reply
No more