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FA880外壳
tobasic
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FA880外壳
tobasic
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X1 Carbon
P1S
P1P
X1
X1E
A1
0.16mm layer, 3 walls, 20% infill
Designer
7 h
2 plates
Open in Bambu Studio
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Description
FEVM系列的FA880迷你主机外壳
小主机
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@luk789
感谢分享,作者可否考虑将外壳加厚2-4mm,以增加强度
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