Bing3D料盘适配AMS转接件
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Bing3D料盘适配AMS转接件
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0.6mm nozzle, 0.42mm layer, 2 walls, 15% infill
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32 min
1 plate
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Description
适用于Bing3D可拆卸料盘装载Bambulab耗材，在Bing3D料盘上对准孔位安装转接件后，再将Bambulab耗材对准转接件上的孔位安装，使料盘卡住耗材转动不打滑可回抽
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