(New) Round Switch

Date of Publication
2025/03/29

Item Name
(New) Round Switch

Category
Communication

Material
PLA

Design
Ryosuke Kosaka (Shinkougeisha)

Comment
For those who want to operate ICT devices using a switch

Points
How
This is a shape exclusive to the circuit board for earphone jacks sold by the ICT Rehabilitation Research Association. It can be easily used without soldering.
Purchase of circuit board: https://store.co-cre-hub.com/category/goods/parts/ITEM67F8AF97/
Data for two types of "springs" made by 3D printing is included. These are used by incorporating them into the main body. It can be used with three different pressures: "Spring 1.2mm", "Spring 0.8mm", and "No Spring".
Please set Layer height = 0.12mm when printing.

Outcome
Materials Used
PLA

Summary of Print Settings
Main body: Nozzle diameter = 0.4mm, Layer height = 0.12mm, Infill = 15%, Support = None

Remarks
Layer height = 0.12mm

Note: Created with the support of the Public Interest Incorporated Foundation Japan Philanthropic Foundation's 2nd "Future Nursing Care Fund"