Enclosure Insulation Plate - Free 3D Print Model

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小樹

3D Printer>3D Printer Parts

IP Report

Print Profile(2)

All

P1S

P1P

X1 Carbon

X1E

H2D

H2D Pro

H2S

P2S

H2C

X2D

A2L

ASA 0.2mm layer, 4 walls, 15% infill

Designer

1.6 h

1 plate

5.0(4)

TPU 0.2mm layer, 3 walls, 15% infill

Designer

20 min

1 plate

5.0(2)

Open in Bambu Studio

Boost

Released

Description

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The original designer's heat bed connection groove is lengthened to allow the connection wire to move better with the heat bed when it moves up and down, preventing pulling.

And add a small TPU partition to prevent the enclosure temperature from dissipating easily.

There is also a small groove near the top to prevent it from interfering with the original wires.

There are two files. The main body is printed with PolyLite ASA. The middle groove partition is made of TPU material. Please note!

After printing the two parts, use 3M double-sided adhesive to stick them together.

Heating

Enclosure Temperature

Comment & Rating (12)

@svenruhland18

Print Profile

ASA 0.2mm layer, 4 walls, 15% infill

fits perfectly

The profile uploader has replied

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@user_2320957511

Thank you

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@max.pfeil

Pls upload the CAD (step or f3d)!

@Jochen73

Boosted

Give the cable significantly more space

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@kehali_w

Boosted

Great job!

@KarlKode

Boosted

Printed in Bambu Lab ABS using the P1S. Dovetail connection was a bit tight but I sanded the dovetails a bit and used CA glue to securely stick both sides together and seal the small cracks. Used Extrudr Semisoft (A85) TPU for the skirts and 3M tape to stick the skirts to the ABS. Mounting was a tight fit but with the right angle you can get the divider in place with a little force. Haven't done any measurements yet, but seams reasonable that the MC board stays cooler with this mod.