Audio Jack Dust Cover

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LR Systems

Household>Office

IP Report

Print Profile(1)

All

A1 mini

H2C

P2S

P1S

X2D

H2D Pro

H2D

P1P

A2L

X1E

H2S

X1 Carbon

0.12mm layer, 4 walls, 20% infill

Designer

22 min

1 plate

5.0(4)

Open in Bambu Studio

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114

Released

Bill of Materials

Bambu Filaments

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Black(30105) / Filament with spool / 1kg

PETG Basic

Description

This 3D printed audio jack dust cover is designed to protect your computer's headphone or microphone port from dust and debris. It fits securely into standard 3.5mm jacks without damaging internal contacts. Made from durable plastic like PLA or PETG, it provides reliable protection while being easy to insert and remove. Perfect for keeping unused ports clean and extending the life of your audio hardware.

Recommended Material

PETG
- All prints & tests were done with PETG. Feel free to use other materials.

Note

The uploaded profile only contains slicer settings. Please change material and printer settings to your needs.

Comment & Rating (6)

@ThePugGamer123

Print Profile

0.12mm layer, 4 walls, 20% infill

a bit long for my application but still good

@taekwondosueca

Print Profile

0.12mm layer, 4 walls, 20% infill

The profile uploader has replied

@LR_Systems_Co.

Thank you!

@ulimativ

Print Profile

0.12mm layer, 4 walls, 20% infill

The profile uploader has replied

@LR_Systems_Co.

Thank you!

@1708029374

Print Profile

0.12mm layer, 4 walls, 20% infill

No more

License

This user content is licensed under a Standard Digital File License.

You shall not share, sub-license, sell, rent, host, transfer, or distribute in any way the digital or 3D printed versions of this object, nor any other derivative work of this object in its digital or physical format (including - but not limited to - remixes of this object, and hosting on other digital platforms). The objects may not be used without permission in any way whatsoever in which you charge money, or collect fees.